Board mounting of microphone transducer
View Patent ↗A portable communication device assembly comprising a housing and a PCB provided therein. A microphone is provided at least partly within an aperture in the PCB, which aperture is positioned adjacent to a sound input of the housing. The microphone may be attached to a carrier element also attached to the PCB, and additional electronic components may be attached to the carrier element. Acoustic and/or electromagnetic shielding may be provided.
1. A portable communication device assembly comprising:
a housing comprising a housing portion having first opening for receiving sound;
a first printed circuit board positioned adjacent to the housing portion and comprising a second opening or cavity positioned adjacent to the first opening;
a microphone for generating sound, the microphone being positioned at least partly in the second opening or cavity;
wherein the second opening or cavity extends through the first printed circuit board from a first side to a second side thereof, the communication device assembly further comprising a carrier element attached to the first printed circuit board and to which the microphone is attached, and
wherein the carrier element is arranged on the first side of the first printed circuit board and the housing portion is arranged on the second side of the first printed circuit board.
2. A portable communication device assembly according to claim 1 , further comprising means provided between the first printed circuit board and the carrier element for acoustically scaling the second opening or cavity at the first side of the first printed circuit board.
3. A portable communication device assembly according to claim 1 , further comprising means provided between the first printed circuit board and the carrier element for electromagnetically sealing the microphone from the surroundings of the first printed circuit board and the carrier element.
4. A portable communication device assembly according to claim 1 , wherein:
the carrier element is a second printed circuit board comprising a number of electrically conducting paths;
the microphone is electrically connected to one or more of the conducting paths; and
one or more of the conducting paths are electrically connected to conductive parts of the first conductive circuit board.
5. A portable communication device assembly according to claim 4 , further comprising electronic components connected to the conducting paths of the carrier element.
6. A portable communication device assembly according to claim 4 , wherein the second opening or cavity extends through the first printed circuit board from a first side to a second side thereof, and wherein the second part is formed by at least a part of a cavity of a second element attached to the first printed circuit board.
7. A portable communication device assembly according to claim 1 , wherein the microphone comprises a first and a second part engaging each other:
the first part comprising a diaphragm and comprising an inner surface defining a cavity, the diaphragm fanning at least part of the inner surface;
the second part defining a cavity having an opening facing the diaphragm.
8. A portable communication device assembly according to claim 7 , wherein the second part is formed by at least part of the second opening or cavity of the first printed circuit board.
9. A portable communication device assembly according to claim 1 , wherein the microphone comprises a MEMS transducer element or a temperature resistant ASIC.
10. A portable communication device assembly according to claim 1 , wherein the assembly comprises:
an electroacoustic transducer adapted to output an electrical signal and a processing circuit adapted to process the electrical signal from the transducer,
the carrier element having a first side and a second side, and the transducer and processing circuit being fixed to the same side of the carrier element.
11. An assembly according to claim 10 , wherein the carrier element further comprises electrical conductors connecting the transducer and the circuit.
12. An assembly according to claim 10 , wherein the carrier element has a hole in the side thereof, and wherein the transducer element is positioned so as to cover the hole.
13. An assembly according to claim 10 , wherein the carrier element has, on the side thereof and encircling the transducer and the circuit, a sealing element.
14. A portable communication device comprising a portable communication device assembly according to claim 1 .
15. A portable communication device assembly comprising:
a housing comprising a housing portion having a first opening for receiving sound;
a first printed circuit board positioned adjacent to the housing portion and comprising a second opening or cavity positioned adjacent to the first opening; and
a microphone for generating sound, the microphone being positioned at least partly in the second opening or cavity,
wherein the second opening or cavity extends through the first printed circuit board from a first side to a second side thereof, the communication device assembly further comprising a carrier element attached to the first printed circuit board and to which the microphone is attached, and
wherein the first printed circuit board, the microphone and the carrier element are arranged inside the housing.
16. A portable communication device assembly comprising:
a housing comprising a housing portion having a first opening for receiving sound;
a first printed circuit board positioned adjacent to the housing portion and comprising a second opening or cavity positioned adjacent to the first opening; and
a microphone for generating sound, the microphone being positioned at least partly in the second opening or cavity,
wherein the microphone comprises a first and a second part engaging each other:
the first part comprising a diaphragm and comprising an inner surface defining a cavity, the diaphragm forming at least part of the inner surface;
the second part defining a cavity having an opening facing the diaphragm, and
wherein the second part is formed by at least part of the second cavity of the first printed circuit board.