Shield case and MEMS microphone having it
View Patent ↗To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness. The shield case according to the invention is a shield case for shielding an MEMS chip mounted on a board from the outside, which includes a top plate and a plurality of side plates and the thickness of each of the plurality of side plates is larger than that of the top plate. According to this configuration, the area of the top plate can be made larger as compared with a conventional shield case having a uniform thickness. Thus, the area for adhering the gasket to the top plate can be secured without changing the position, size and range etc. of the chucking area from those of the conventional shield case.
1. A MEMS microphone, comprising:
a board;
a MEMS chip mounted on the board; and
a shield case formed over the mounted MEMS chip, the shield case having a top plate and a side plate,
wherein a thickness of the side plate is larger than a thickness of the top plate, and a center of the gravity of the shield case is lower than that of a shield case having a top plate and a side plate of the same thickness.
2. The MEMS microphone according to claim 1 wherein an end portion of the side plate is attached on a surface of the board on which the MEMS chip is mounted.
3. The MEMS microphone according to claim 1 , wherein a bent portion formed by an end portion of the top plate and an end portion of the side plate is formed to have a corner.
4. The MEMS microphone according to claim 1 , wherein an end portion of the side plate has a R shaped portion toward inside of the shield case.
5. The MEMS microphone according to claim 2 , wherein the end portion of the side plate has a R shaped portion toward inside of the shield case.
6. The MEMS microphone according to claim 3 , wherein the other end portion of the side plate has a R shaped portion toward inside of the shield case.
7. The MEMS microphone according to claim 4 , wherein a solder is formed between the R shaped portion of the end portion of the side plate and the board.
8. MEMS microphone according to claim 5 , wherein a solder is formed between the R shaped portion of the other end portion of the side plate and the board.
9. The MEMS microphone according to claim 6 , wherein a solder is formed between the R shaped portion of the other end portion of the side plate and the board.
10. The MEMS microphone according to claim 1 , wherein an end portion of the top plate has a corner and a flat portion of the top plate is on the side plate.
11. The MEMS microphone according to claim 1 , wherein the shield case has a Ni plating.
12. The MEMS microphone according to claim 2 , wherein the shield case has a Ni plating.
13. The MEMS microphone according to claim 4 , wherein the shield case has a Ni plating.
14. The MEMS microphone according to claim 1 , wherein a thickness of the top plate is 0.1 mm and a thickness of the side plate is 0.25 mm.
15. The MEMS microphone according to claim 2 , wherein a thickness of the top plate is 0.1 mm and a thickness of the side plate is 0.25 mm.
16. The MEMS microphone according to claim 4 , wherein a thickness of the top plate is 0.1 mm and a thickness of the side plate is 0.25 mm.
17. The MEMS microphone according to claim 1 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
18. The MEMS microphone according to claim 1 , wherein a size of a mounting surface of the board is 3×4 mm or less.
19. The MEMS microphone according to claim 2 , wherein a size of a mounting surface of the board is 3×4 mm or less.
20. The MEMS microphone according to claim 4 , wherein a size of a mounting surface of the board is 3×4 mm or less.
21. The MEMS microphone according to claim 7 , wherein a size of a mounting surface of the board is 3×4 mm or less.
22. The MEMS microphone according to claim 14 , wherein a size of a mounting surface of the board is 3×4 mm or less.
23. The MEMS microphone according to claim 14 , wherein a size of a mounting surface of the board is 3×4 mm or less.
24. The MEMS microphone according to claim 18 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
25. The MEMS microphone according to claim 19 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
26. The MEMS microphone according to claim 20 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
27. The MEMS microphone according to claim 21 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
28. The MEMS microphone according to claim 22 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
29. The MEMS microphone according to claim 23 , wherein the top plate has a sound hole and a distance from the sound hole to an end portion of the top plate is 1 mm or more.
30. The MEMS microphone according to claim 1 , wherein the top plate and the side plate are single-piece and the top plate and the side plate comprise metal.
31. The MEMS microphone according to claim 4 , wherein the top plate and the side plate are single-piece and the top plate and the side plate comprise metal.
32. The MEMS microphone according to claim 14 , wherein the top plate and the side plate are single-piece and the top plate and the side plate comprise metal.
33. The MEMS microphone according to claim 18 , wherein the top plate and the side plate are single-piece and the top plate and the side plate comprise metal.
34. The MEMS microphone according to claim 24 , wherein the top plate and the side plate are single-piece and the top plate and the side plate comprise metal.
35. A mobile phone comprising:
a case; and
a MEMS microphone comprising a board, a MEMS chip mounted on the board and a shield case, formed over the mounted MEMS chip, the shield case having a top plate and a side plate,
wherein a thickness of the side plate is larger than a thickness of the top plate, and a center of the gravity of the shield case is lower than that of a shield case having a top plate and a side plate of the same thickness.
36. The mobile phone according to claim 35 , wherein an end portion of the side plate is attached on a surface, of the board on which the MEMS chip is mounted.
37. The mobile phone according to claim 35 , wherein a gasket is secured between the MEMS microphone and the case.
38. The mobile phone according to claim 35 , wherein a sound hole of the top plate and a sound hole of the case are connected.
39. The mobile phone according to claim 35 , wherein an acoustic resistance material is formed between a sound hole of the top plate and a sound hole of the case.