IP Library Assignment 031138/0412
Patent Assignment
Reel/Frame 031138/0412

Assignment of Assignor's Interest

Recorded: 2013-09-04 Pages: 3
Assignor
PANASONIC CORPORATION
Executed: 2013-07-31
Assignee
EPCOS AG
ST.-MARTIN-STR. 53, MUNICH, 81669, GERMANY
Covered Properties (21)
Electret Condenser Microphone
Patent: 7,466,834 →
Application: 10/592,116 →
Publication: US 2007/0189558
Bonded Structure and Bonding Method
Patent: 7,629,688 →
Application: 11/491,029 →
Publication: US 2007/0035035
Connection Structure and Method for Fabricating the Same
Patent: 7,495,339 →
Application: 11/544,633 →
Publication: US 2007/0187834
Electretization Method and Apparatus
Patent: 8,073,166 →
Application: 11/702,530 →
Publication: US 2007/0274544
Semiconductor Substrate, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
Patent: 7,808,059 →
Application: 11/797,292 →
Publication: US 2007/0264803
Shield Case and Mems Microphone Having It
Patent: 7,904,123 →
Application: 12/160,663 →
Publication: US 2010/0167799
Method of Fabricating an Ultra-Small Condenser Microphone
Patent: 7,855,095 →
Application: 12/265,431 →
Publication: US 2009/0130783
Method of Fabricating an Ultra-Small Condenser Microphone
Patent: 7,941,909 →
Application: 12/265,453 →
Publication: US 2009/0119905
Electret Condenser Microphone
Patent: 8,155,355 →
Application: 12/276,820 →
Publication: US 2009/0080682
Semiconductor Substrate
Patent: 7,859,084 →
Application: 12/391,671 →
Publication: US 2009/0218660
Microphone and Method for Fabricating the Same
Patent: 8,077,900 →
Application: 12/396,010 →
Publication: US 2009/0238394
Sensor Device and Fabrication Method for the Same
Patent: 7,915,697 →
Application: 12/404,923 →
Publication: US 2009/0242940
Mems Device and Method for Manufacturing the Same
Patent: 8,166,827 →
Application: 12/436,374 →
Publication: US 2010/0059836
Semiconductor Substrate, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
Patent: 7,754,584 →
Application: 12/570,548 →
Publication: US 2010/0015781
Method for Fabricating Semiconductor Device
Patent: 7,838,323 →
Application: 12/578,040 →
Publication: US 2010/0022046
Bonded Structure and Bonding Method
Patent: 8,012,869 →
Application: 12/614,170 →
Publication: US 2010/0048017
Piezoelectric Body Module and Manufacturing Method Therefor
Patent: 8,311,247 →
Application: 12/617,309 →
Publication: US 2010/0124344
Mems Device, Mems Device Module and Acoustic Transducer
Patent: 7,847,359 →
Application: 12/622,975 →
Publication: US 2010/0065932
Diaphragm Structure and Mems Device
Patent: 8,146,437 →
Application: 12/630,179 →
Publication: US 2010/0077863
Method of Fabricating an Ultra-Small Condenser Microphone
Patent: 8,114,700 →
Application: 12/917,916 →
Publication: US 2011/0045616
Mems Device, Mems Device Module and Acoustic Transducer
Patent: 8,067,811 →
Application: 12/938,007 →
Publication: US 2011/0042763
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2006
From: MINAMIO, MASANORI; FUJIMOTO, HIROAKI; MIZUTANI, ATSUHITO; FUJITANI, HISAKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018585/0676 →
Assignment of Assignor's Interest Mar 13, 2007
From: MINAMIO, MASANORI; FUJIMOTO, HIROAKI; MIZUTANI, ATSUHITO; FUJITANI, HISAKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019003/0094 →
Assignment of Assignor's Interest Jul 12, 2007
From: TAKEUCHI, YUSUKE; OGURA, HIROSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019551/0349 →
Assignment of Assignor's Interest Aug 17, 2007
From: KUMAKAWA, TAKAHIRO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019712/0527 →
Assignment of Assignor's Interest Aug 28, 2007
From: OGURA, HIROSHI; YAMAOKA, TOHRU
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019755/0144 →
Assignment of Assignor's Interest Aug 21, 2008
From: MAKIHATA, KATSUHIRO; KIMURA, NORIO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021421/0307 →
Change of Name Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0534 →
Change of Name Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0588 →
Change of Name Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →
Assignment of Assignor's Interest Jan 2, 2009
From: MIYASHITA, YOSHIYUKI; TAKAHASHI, NAOKI; YAMAMOTO, TAKASHI; ICHIKAWA, SHINICHI
To: PANASONIC CORPORATION
Reel/Frame 022048/0539 →
Assignment of Assignor's Interest Jan 2, 2009
From: MIYASHITA, YOSHIYUKI; DOI, KAZUMOTO; IMAI, TADAO; IWASEKI, HIROAKI
To: PANASONIC CORPORATION
Reel/Frame 022048/0510 →
Change of Name Mar 6, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022363/0306 →
Assignment of Assignor's Interest Mar 30, 2009
From: MINAMIO, MASANORI; TOMITA, YOSHIHIRO; NOMURA, KOJI
To: PANASONIC CORPORATION
Reel/Frame 022469/0265 →
Assignment of Assignor's Interest Apr 3, 2009
From: UTSUMI, MASAKI; KUMAKAWA, TAKAHIRO
To: PANASONIC CORPORATION
Reel/Frame 022502/0072 →
Assignment of Assignor's Interest Apr 23, 2009
From: MINAMIO, MASANORI; TOMITA, YOSHIHIRO
To: PANASONIC CORPORATION
Reel/Frame 022586/0970 →
Assignment of Assignor's Interest Jun 11, 2009
From: MIYOSHI, YUICHI; YAMAOKA, TOHRU; NOTAKE, HIDENORI; TAKEUCHI, YUSUKE
To: PANASONIC CORPORATION
Reel/Frame 022812/0557 →
Assignment of Assignor's Interest Jan 26, 2010
From: MIZUTANI, ATSUHITO; KOJIMA, HIDEKI; MAKIHATA, KATUHIRO
To: PANASONIC CORPORATION
Reel/Frame 023847/0480 →
Assignment of Assignor's Interest Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041265/0442 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →