Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device
View Patent ↗In a semiconductor substrate 1 , a plurality of semiconductor elements 2 having diaphragm structures are formed in the form of cells in the longitudinal direction and the lateral direction, and V-grooves 3 are formed by anisotropic etching continuously on only division lines 4 parallel formed in one direction, out of the division lines 4 which are orthogonal to each other and divide the respective semiconductor elements 2 individually.
1. A method of manufacturing a semiconductor device comprising the steps of:
setting a division line in a first direction and a second direction intersecting each other for individually dividing a plurality of semiconductor elements formed on a semiconductor substrate to form a groove by etching on the first direction division line, out of the division lines in the first direction and second direction surrounding said semiconductor elements;
forming a modified region inside the semiconductor substrate by irradiating laser light along the groove on the first direction division line and along the second direction division line; and
dividing the semiconductor substrate along the first and second direction division lines to form individual semiconductor devices,
wherein the groove has no intersecting pattern.
2. A method of manufacturing a semiconductor device according to claim 1 , comprising a further step of:
forming a diaphragm structure on each said semiconductor element.
3. A method of manufacturing a semiconductor device according to claim 1 ,
wherein the groove is continuously formed on the first direction division line.
4. A method of manufacturing a semiconductor device according to claim 1 ,
wherein the groove is formed as a V-groove on the first direction division line.
5. A method of manufacturing a semiconductor device according to claim 1 ,
wherein the groove is formed as a U-groove on the first direction division line.
6. A method of manufacturing a semiconductor device according to claim 2 ,
wherein the step of forming the groove on the first direction division line and the step of forming the diaphragm structure on said semiconductor element are performed by anisotropic etching.
7. A method of manufacturing a semiconductor device according to claim 1 ,
wherein in the step of forming a modified region inside said semiconductor substrate, the number of times of scanning laser light along the first direction division line where the grooves are formed is less than the number of times of scanning the laser light along the second division line where no groove is formed.
8. A method of manufacturing a semiconductor device according to claim 1 ,
wherein the step of dividing the semiconductor substrate along the first and second direction division line to form individual semiconductor devices is performed by applying an external force to the semiconductor substrate.
9. A method of manufacturing a semiconductor module comprising the step of:
bonding the semiconductor device manufactured by the method of manufacturing the semiconductor device according to claim 1 onto a mounting substrate.
10. A method of manufacturing a semiconductor module according to claim 9 ,
wherein in the step of bonding the semiconductor device on the mounting substrate, a back surface of the semiconductor device is bonded onto the mounting substrate with die bond material.
11. A method of manufacturing a semiconductor device comprising the steps of:
setting a division line in a first direction and a second direction intersecting each other for individually dividing a plurality of semiconductor elements formed on a semiconductor substrate to form a groove by etching on the first direction division line, out of the division lines in the first direction and second direction surrounding said semiconductor elements;
forming a modified region inside the semiconductor substrate by irradiating laser light along the first and second direction division lines; and
dividing the semiconductor substrate along the first and second direction division lines to form individual semiconductor devices,
wherein the groove has no intersecting pattern, and
wherein in the step of forming a modified region inside the semiconductor substrate, the number of times of scanning laser light along the direction division lines where the grooves are formed is less than the number of times of scanning the laser light along the division lines where no groove is formed.