Patent Assignment
Reel/Frame 018585/0676
Assignment of Assignor's Interest
Recorded: 2006-12-05
Pages: 4
Assignors
MINAMIO, MASANORI
Executed: 2006-05-12
FUJIMOTO, HIROAKI
Executed: 2006-05-12
MIZUTANI, ATSUHITO
Executed: 2006-05-12
FUJITANI, HISAKI
Executed: 2006-05-12
FUKUDA, TOSHIYUKI
Executed: 2006-05-12
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Bonded Structure and Bonding Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →
Assignment of Assignor's Interest
Sep 4, 2013
From: PANASONIC CORPORATION
To: EPCOS AG
Reel/Frame 031138/0412 →
Assignment of Assignor's Interest
Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041265/0442 →
Assignment of Assignor's Interest
Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →