Method of fabricating an ultra-small condenser microphone
View Patent ↗In the present invention, a plurality of condenser microphones is formed on a substrate. Then, charges are fixed to a dielectric film provided in each of the condenser microphones. After an amount of deposited charges of the dielectric film of each of the plurality of the condenser microphones is inspected by measuring capacitance of each condenser microphone while applying bias between the first electrode film thereof and the second electrode film thereof, the substrate is diced so that each of the condenser microphones is separated. Thus, at least the step of fixing charges is performed in a substrate state where the plurality of the condenser microphones is formed on the substrate. Therefore, the present invention contributes to enhancement of productivity in an assembly process of the condenser microphone and reduction in equipment costs.
1. A method of fabricating a condenser microphone, comprising the steps of:
(a) forming a plurality of condenser microphones on a substrate, each of the condenser microphones including a first electrode film formed on the substrate, a dielectric film formed on the first electrode film and a second electrode film formed above the dielectric film, the substrate is formed under a periphery portion of the first electrode film and includes an opening under the dielectric film;
(b) fixing charges to the dielectric film of each of the plurality of the condenser microphones formed in the step (a);
(c) inspecting an amount of deposited charges of the dielectric film of each of the plurality of the condenser microphones by measuring capacitance of each condenser microphone while applying bias between the first electrode film thereof and the second electrode film thereof; and
(d) dicing the substrate whereon the plurality of the condenser microphones is formed and separating each condenser microphone,
wherein at least the step (b) is performed in a substrate state where the plurality of the condenser microphones is formed on the substrate,
2. A method according to of claim 1 , further comprising the step of:
(e) annealing each condenser microphone in the substrate state after the step (b) is performed.
3. A method according to claim 1 , wherein the step (c) is performed in the substrate state.
4. A method according to claim 2 , wherein the step (c) is performed in the substrate state.
5. A method according to claim 1 , further comprising the step of:
(f) dice bonding each condenser microphone separated in the step (d) to a mounting board for packaging.
6. A method according to claim 2 , further comprising the step of:
(f) dice bonding each condenser microphone separated in the step (d) to a mounting board for packaging.
7. A method according to claim, 3 , further comprising the step of:
(f) dice bonding each condenser microphone separated in the step (d) to a mounting board for packaging.
8. A method according to claim 1 , wherein the step (b) for one of the condenser microphones on the substrate and the step (c) for another of the condenser microphones completed the step (b) on the substrate are simultaneously performed.
9. A method according to claim 1 , further comprising the step of:
classifying the plurality of the condenser microphones into a first group and a second group based on an inspection result in the step (c), and wherein each condenser microphone in the first group is bonded to a mounting board for packaging and each condenser microphone in the second group is not bonded to the mounting board for packaging.