MEMS device, MEMS device module and acoustic transducer
View Patent ↗A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a region containing N-type majority carriers. A concentration of N-type majority carriers in a portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film, is higher than a concentration of N-type majority carriers in the other portion of the semiconductor substrate.
1. An acoustic transducer comprising:
a semiconductor substrate;
a movable electrode formed above the semiconductor substrate;
a fixed electrode formed above the semiconductor substrate;
a first insulating film provided between the semiconductor substrate and a portion of the movable electrode; and
a second insulating film provided between the semiconductor substrate and a portion of the fixed electrode,
wherein:
the semiconductor substrate, the first insulating film and the movable electrode comprise a first MIS structure,
the semiconductor substrate, the second insulating film and the fixed electrode comprise a second MIS structure,
an interface charge having a first polarity is present at an interface between the semiconductor substrate and at least one of the first insulating film and the second insulating film,
the semiconductor substrate has, as majority carriers, carriers having a second polarity different from the first polarity, and
the interface charge having the first polarity is present in the first insulating film in a vicinity of the interface between the semiconductor substrate and the first insulating film.
2. The acoustic transducer of claim 1 , wherein
the semiconductor substrate is a silicon substrate having a region containing N-type majority carriers.
3. The acoustic transducer of claim 2 , wherein:
the silicon substrate contacts the first insulating film, and
the region containing N-type majority carriers is provided in at least a portion of the silicon substrate in which the silicon substrate contacts the first insulating film.
4. The acoustic transducer of claim 3 , wherein
a concentration of N-type majority carriers in the portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film is higher than a concentration of N-type majority carriers in other portions of the semiconductor substrate.
5. The acoustic transducer of claim 2 , wherein
the silicon substrate is an N-type silicon substrate.
6. The acoustic transducer of claim 1 , wherein:
the movable electrode and the fixed electrode constitute a condenser structure, and
a capacitance of the condenser structure varies due to vibration of the movable electrode which is caused in response to sound pressure.
7. The acoustic transducer of claim 1 , wherein, the doping of the substrate does not contribute to the presence of the interface charge in the first insulating film.
8. The acoustic transducer of claim 7 , wherein
the semiconductor substrate is a silicon substrate having a region containing N-type majority carriers.
9. The acoustic transducer of claim 8 , wherein:
the silicon substrate contacts the first insulating film, and
the region containing N-type majority carriers is provided in at least a portion of the silicon substrate in which the silicon substrate contacts the first insulating film.
10. The acoustic transducer of claim 9 , wherein
a concentration of N-type majority carriers in the portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film is higher than a concentration of N-type majority carriers in the other portion of the semiconductor substrate.
11. The acoustic transducer of claim 8 , wherein
the silicon substrate is an N-type silicon substrate.
12. The acoustic transducer of claim 7 , wherein:
the movable electrode and the fixed electrode constitute a condenser structure, and
a capacitance of the condenser structure varies due to vibration of the movable electrode which is caused in response to sound pressure.