IP Library Granted Patent US 7,466,834
Granted Patent B2
US 7,466,834 · App. 10/592,116 · Granted Dec 16, 2008

Electret condenser microphone

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Quick Facts
Patent No.
US 7,466,834
App. No.
10/592,116
Granted
Dec 16, 2008
Kind
B2
Abstract

An electret condenser microphone includes: a substrate 13 in which an opening 25 is formed; an electret condenser 50 connected to one face of the substrate 13 so as to close the opening 25 and having an acoustic hole 12 and a cavity 2; a drive circuit element 15 connected to the one face of the substrate 13; and a case 17 mounted over the substrate 13 so as to cover the electret condenser 50 and the drive circuit element 15. Electric contact is established at a joint part between the electret condenser 50 and the substrate 13. The acoustic hole 12 communicates with an external space through the opening 25. The cavity 2 and an internal region of the case 17 serve as a back air chamber for the electret condenser 50.

Claims (18)

1. An electret condenser microphone, comprising:

a substrate in which an opening is formed;

an electret condenser connected to one face of the substrate so as to close the opening and having an acoustic hole and a cavity;

a drive circuit element connected to the one face of the substrate; and

a case mounted over the substrate so as to cover the electret condenser and the drive circuit element,

wherein electric contact is established at a joint part between the electret condenser and the substrate,

the acoustic hole communicates with an external space through the opening, and

the cavity and an internal region of the case serve as a back air chamber for the electret condenser.

2. The electret condenser microphone of claim 1 ,

wherein the acoustic hole includes a plurality of acoustic holes each having a diameter of 3 μm or smaller.

3. The electret condenser microphone of claim 1 ,

wherein the substrate is formed of a multilayer substrate.

4. The electret condenser microphone of claim 3 ,

wherein the multilayer substrate is made of ceramic.

5. The electret condenser microphone of claim 3 ,

wherein the opening is a hollow formed in the multilayer substrate so that the acoustic hole is not seen directly from the external space.

6. The electret condenser microphone of claim 1 ,

wherein the electret condenser and the substrate are joined to each other with the use of a metal protrusion and an anisotropic conductive resin.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041265/0442 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2013
From: PANASONIC CORPORATION
To: EPCOS AG
Reel/Frame 031138/0412 →
CHANGE OF NAME Recorded Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0588 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2007
From: OGURA, HIROSHI; YAMAOKA, TOHRU
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019755/0144 →