IP Library › Assignment 019712/0527
Patent Assignment
Reel/Frame 019712/0527

Assignment of Assignor's Interest

Recorded: 2007-08-17 Pages: 2
Assignor
KUMAKAWA, TAKAHIRO
Executed: 2007-04-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Semiconductor Substrate, and Semiconductor Device and Method of Manufacturing the Semiconductor Device
Patent: 7,808,059 →
Application: 11/797,292 →
Publication: US 2007/0264803
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0534 →
Assignment of Assignor's Interest Sep 4, 2013
From: PANASONIC CORPORATION
To: EPCOS AG
Reel/Frame 031138/0412 →
Assignment of Assignor's Interest Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041265/0442 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →