IP Library Granted Patent US 11,736,845
Granted Patent B2
US 11,736,845 · App. 17/206,297 · Granted Aug 22, 2023

Microphone component and method for fabricating microphone component

Inventors: Pirmin Hermann Otto Rombach (Kongens Lyngby, DK); Dennis Mortensen (Bagsvard, DK)
Assignee: TDK Corporation
H04R1/08H04R2201/003
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Quick Facts
Patent No.
US 11,736,845
App. No.
17/206,297
Granted
Aug 22, 2023
Kind
B2
Abstract

A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a microphone component includes a membrane and a backplate, wherein the membrane includes a plurality of holes, and wherein the holes have diameters smaller than 5 μm.

Claims (43)

1. A microphone component comprising:

a membrane; and

a backplate,

wherein the membrane comprises a plurality of holes, the holes having diameters smaller than 5 μm,

wherein the holes are present at least in a central region of the membrane,

wherein the central region has a first radius, and

wherein a number of holes per surface area in the central region is less than a number of holes per surface area in a region adjoining the central region.

2. The microphone component of claim 1 , wherein the diameters are equal or smaller than 2 μm.

3. The microphone component of claim 1 , wherein a number of holes in the membrane is at least 100.

4. The microphone component of claim 1 , wherein a number and the diameters of the holes are adjusted such that a pre-set value of low-frequency roll-off is achieved.

5. The microphone component of claim 1 , wherein the membrane has a support region, in which the membrane is supported by a substrate, and wherein a clearance region extending from the support region to at least 20 μm from the support region is free from any holes.

6. The microphone component of claim 1 , wherein the backplate comprises further holes, and wherein the holes in the membrane are positioned within the further holes of the backplate in a view on the backplate.

7. The microphone component of claim 6 , wherein the further holes in the backplate have larger diameters than the holes in the membrane.

8. The microphone component of claim 6 , wherein a number of the further holes in the backplate is larger than a number of the holes in the membrane.

9. The microphone component claim 1 , wherein the microphone component has a single-membrane design.

10. A microphone comprising:

the microphone component of claim 1 ; and

an electronic circuit configured to process an output signal of the microphone component.

11. The microphone component claim 1 , wherein the holes are equally distributed in the central region of the membrane.

12. A microphone component comprising:

a membrane; and

a backplate,

wherein the membrane comprises a plurality of holes, the holes having diameters smaller than 5 μm,

wherein the membrane has a central region having a first radius, and

wherein a number of holes per surface area in the central region is less than a number of holes per surface area in a region adjoining the central region or wherein the central region is free from any holes.

13. The microphone component of claim 12 , wherein the diameters are equal or smaller than 2 μm.

14. The microphone component of claim 12 , wherein a number of holes in the membrane is at least wo.

15. A microphone component comprising:

a membrane; and

a backplate,

wherein the membrane comprises a plurality of holes, the holes having diameters smaller than 5 μm,

wherein the holes are positioned within a circular ring region of the membrane, the circular ring region being defined by a first radius and a second radius, and

wherein a number of holes per surface area outside the circular ring region is less than a number of holes per surface area within the circular ring region or wherein the regions outside the circular ring region are free from any holes.

16. The microphone component of claim 15 , wherein the diameters are equal or smaller than 2 μm.

17. The microphone component of claim 15 , wherein a number of holes in the membrane is at least wo.

18. A microphone component comprising:

a membrane; and

a backplate,

wherein the membrane comprises a plurality of holes, the holes having diameters smaller than 5 μm,

wherein the holes are present at least in a central region of the membrane,

wherein the holes are positioned within a circular ring region of the membrane, the circular ring region being defined by a first radius and a second radius, and

wherein a number of holes per surface area outside the circular ring region is less than a number of holes per surface area within the circular ring region, or

wherein the regions outside the circular ring region are free from any holes.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2021
From: ROMBACH, PIRMIN HERMANN OTTO, DR.; MORTENSEN, DENNIS
To: TDK ELECTRONICS AG
Reel/Frame 056743/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2021
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 056743/0936 →
Priority Claims (1)
DE 102020108527.3 · Mar 27, 2020 · national
Continuity (1)
Related Publication 20210306728A1 · Sep 30, 2021