Component which can be produced at wafer level and method of production
A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.
1. A component comprising:
a first chip having an upper side;
a second chip having a lower side, the second chip being a MEMS chip;
a first connecting structure and a second connecting structure on the upper side of the first chip;
a first contact structure and a second contact structure on the lower side of the second chip; and
an adaptation structure between the first chip and the first connecting structure,
wherein the first connecting structure is connected to the first contact structure and the second connecting structure is connected to the second contact structure through metallizations on the connecting structures and a solder material on the metallizations,
wherein the connecting and contact structures have the same height,
wherein a contact surface of the second contact structure is more remote from the lower side of the second chip than a corresponding contact surface of the first contact structure,
wherein a thickness of the adaptation structure is equal to a difference in distances between the contact surfaces of the contact structures and the lower side of the second chip given by way of MEMS structures on the lower side of the MEMS chip, and
wherein the adaption structure is a single integral piece directly connected to the upper side of the first chip.
2. The component according to claim 1 , wherein the first chip is an ASIC chip,
wherein the second chip comprises an electrically conductive membrane, a counter electrode, and a back volume, and wherein the component is a microphone.
3. The component according to claim 1 , wherein circuit elements of the first chip are interconnected with circuit elements of the second chip via the connecting structures and the contact structures.
4. The component according to claim 1 , further comprising a frame structure that is complete or has a lateral opening, wherein the frame structure is formed by one of the connecting structures, one of the contact structures, or a further frame-shaped structure.
5. The component according to claim 1 , wherein one of the connecting structures or one of the contact structures serves as a support structure.
6. The component according to claim 1 , further comprising a support structure separate from the connecting structures and the contact structures.
7. The component according to claim 1 , further comprising an electromagnetic shield for the first chip, the second chip, or the entire component.
8. The component according to claim 7 , wherein a body of the first chip and a body of the second chip are not directly interconnected via the shield.
9. The component according to claim 1 , wherein the first chip is an ASIC chip.