IP Library Assignment 037226/0631
Patent Assignment
Reel/Frame 037226/0631

Assignment of Assignor's Interest

Recorded: 2015-12-07 Pages: 3
Assignor
PAHL, WOLFGANG
Executed: 2015-11-19
Assignee
EPCOS AG
ST.-MARTIN-STRASSE 53, MUENCHEN, 81669, GERMANY
Covered Property (1)
Component Which Can Be Produced at Wafer Level and Method of Production
Patent: 9,718,673 →
Application: 14/787,551 →
Publication: US 2016/0075552
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041263/0032 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →