Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.
1. A microelectromechanical microphone device comprising:
a flexible plate that is deformable by a pressure wave, the flexible plate comprising a reverse bending edge comprising a first lateral etch stop comprising a first corner radius and a second lateral etch stop comprising a second corner radius different than the first corner radius;
a rigid plate mechanically coupled to the flexible plate, the rigid plate comprising openings configured to permit passage of the pressure wave; and
a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate, wherein the stoppage member is configured to limit motion of the flexible plate in response to the pressure wave.
2. The microelectromechanical microphone device of claim 1 , wherein the first corner radius is more than 100 nanometers, and wherein the second corner radius is more than 25 nanometers.
3. The microelectromechanical microphone device of claim 2 , wherein a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.
4. The microelectromechanical microphone device of claim 1 , wherein the rigid plate comprises a stress distributor located between layers of polysilicon.
5. The microelectromechanical microphone device of claim 4 , wherein the stress distributor comprises a nitride layer.
6. A microelectromechanical microphone device comprising:
a flexible plate that is deformable by a pressure wave;
a rigid plate mechanically coupled to the flexible plate, the rigid plate comprising openings configured to permit passage of the pressure wave and a ring-shaped mechanical stress distributor; and
a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate, wherein the stoppage member is configured to limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.
7. The microelectromechanical microphone device of claim 6 , wherein the stress distributor comprises nitride.
8. The microelectromechanical microphone device of claim 6 , wherein the rigid plate comprises a reverse bending edge comprising a first lateral etch stop comprising a first corner radius and a second lateral etch stop comprising a second corner radius different than the first corner radius.
9. The microelectromechanical microphone device of claim 8 , wherein the first corner radius is more than wo nanometers, and wherein the second corner radius is more than 25 nanometers.
10. The microelectromechanical microphone device of claim 8 , wherein a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.
11. The microelectromechanical microphone device of claim 6 , wherein the stress distributor comprises oxide.
12. The microelectromechanical microphone device of claim 6 , wherein the stress distributor comprises a material layer.
13. A microelectromechanical microphone device comprising:
a flexible plate that is deformable by a pressure wave;
a rigid plate mechanically coupled to the flexible plate, the rigid plate comprising openings configured to permit passage of the pressure wave and a stress distributor; and
a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate, wherein the stoppage member is configured to limit motion of the flexible plate in response to the pressure wave including a threshold amplitude,
wherein the rigid plate comprises a reverse bending edge comprising a first lateral etch stop comprising a first corner radius and a second lateral etch stop comprising a second corner radius different than the first corner radius.
14. The microelectromechanical microphone device of claim 13 , wherein the first corner radius is more than 100 nanometers, and wherein the second corner radius is more than 25 nanometers.
15. The microelectromechanical microphone device of claim 13 , wherein a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.
16. The microelectromechanical microphone device of claim 13 , wherein the stress distributor comprises nitride.
17. The microelectromechanical microphone device of claim 13 , wherein the stress distributor comprises oxide.
18. The microelectromechanical microphone device of claim 13 , wherein the stress distributor comprises a material layer.