Patent Assignment
Reel/Frame 068279/0690
Assignment of Assignor's Interest
Recorded: 2024-08-02
Pages: 4
Assignor
TDK ELECTRONICS AG
Executed: 2024-04-23
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 2021
From: ROMBACH, PIRMIN; RASMUSSEN, KURT; MORTENSEN, DENNIS; LIU, CHENG-YEN
To: TDK ELECTRONICS AG
Reel/Frame 056443/0108 →
Corrective Assignment to Correct the the Assignee Name Previously Recorded at Reel: 056443 Frame: 0108. Assignor(S) Hereby Confirms the Assignment.
Dec 20, 2021
From: AKIYAMA, JOTARO
To: TDK CORPORATION
Reel/Frame 058548/0597 →
Assignment of Assignor's Interest
Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →