Top-port MEMS microphone and method of manufacturing the same
A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
1. A top-port Micro-Electro-Mechanical System (MEMS)-microphone, having an upper side and a bottom side, the top-port microphone comprising:
a MEMS chip with a monolithically connected protection element at the upper side, a backplate, a cavity, and a moveable membrane, wherein the moveable membrane and the backplate together are configured to convert acoustic signals into electric signals, wherein the backplate and the moveable membrane are arranged at the bottom side of the MEMS chip, wherein the protection element is a grid having holes extending therethrough, and wherein the protection element is an integral portion of the MEMS chip;
a sound inlet at the upper side; and
a mechanical or electrical connection at the bottom side;
wherein a body of the MEMS chip extends contiguously from a first side of the body, through the protection element, to a second side of the body; and
wherein the first side of the body, the second side of the body, the protection element, and the movable membrane define the cavity.
2. The top-port microphone of claim 1 , wherein the protection element is arranged in the sound inlet.
3. The top-port microphone of claim 1 , wherein the sound inlet defines a front volume, wherein the sound inlet is arranged in the MEMS chip, and wherein the sound inlet has an inside.
4. The top-port microphone of claim 3 , wherein the MEMS chip has a rectangular cross section, and wherein the front volume and the protection element have a circular cross section.
5. The top-port microphone of claim 3 , wherein the protection element is a grid connected to the inside of the sound inlet.
6. The top-port microphone of claim 1 , wherein the protection element is flush with the upper side of the MEMS chip.
7. The top-port microphone of claim 6 , where the protection element has holes that have a cross section that increases with increasing depth.
8. The top-port microphone of claim 1 , wherein the MEMS chip has a rectangular cross section.
9. The top-port microphone of claim 1 , further comprising a carrier substrate, wherein the MEMS chip is electrically or mechanically connected to the carrier substrate.
10. A top-port Micro-Electro-Mechanical System (MEMS)-microphone, having an upper side and a bottom side, the top-port microphone comprising:
a MEMS chip with a monolithically connected protection element at the upper side, a backplate, a cavity, and a membrane, wherein the backplate and the membrane are arranged at the bottom side of the MEMS chip, and wherein the protection element is an integral portion of the MEMS chip;
a sound inlet at the upper side; and
a mechanical or electrical connection at the bottom side, wherein the protection element is flush with the upper side of the MEMS chip, and wherein the protection element is a grid having holes extending therethrough and that have a cross section that increases with increasing depth;
wherein a body of the MEMS chip extends contiguously from a first side of the body, through the protection element, to a second side of the body; and
wherein the first side of the body, the second side of the body, the protection element, and the membrane define the cavity.
11. The top-port microphone of claim 10 , wherein the protection element is arranged in the sound inlet.
12. The top-port microphone of claim 10 , wherein the sound inlet defines a front volume, wherein the sound inlet is arranged in the MEMS chip, and wherein the sound inlet has an inside.
13. The top-port microphone of claim 12 , wherein the MEMS chip has a rectangular cross section, and wherein the front volume and the protection element have a circular cross section.
14. The top-port microphone of claim 12 , wherein the protection element is a grid connected to the inside of the sound inlet.
15. The top-port microphone of claim 10 , wherein the MEMS chip has a rectangular cross section.
16. The top-port microphone of claim 10 , further comprising a carrier substrate, wherein the MEMS chip is electrically or mechanically connected to the carrier substrate.
17. A top-port Micro-Electro-Mechanical System (MEMS) microphone, comprising:
a MEMS chip having a backplate, a moveable membrane, and a cavity defining a front volume wherein a body of the MEMS has an integral portion that is a protection element disposed at an upper side of the MEMS microphone, and wherein a body of the MEMS chip extends contiguously from a first side of the body, through the protection element, to a second side of the body, wherein the first side of the body, the second side of the body, the protection element, and the movable membrane define the cavity, wherein the moveable membrane and the backplate, together, are configured to convert acoustic signals into electric signals, wherein the backplate and the moveable membrane are arranged at a bottom side of the MEMS chip, wherein the protection element is a grid having holes extending therethrough and acting as a sound inlet to the cavity; and
a mechanical or electrical connection at the bottom side of the MEMS microphone.