Resiliently mounted sensor system with damping
A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.
1. A MEMS device, wherein
a sensor system is resiliently mounted on a carrier by means of spring elements,
the spring elements are metallic and comprise an elongated structure that is linear, bent or angled,
a first end of the extended structure is coupled to a first anchor point on the carrier,
a second end of the extended structure is coupled to a second anchor point on the sensor system,
an air gap is provided between a top surface of the carrier and a bottom surface of the sensor system,
a height of the air gap normal to the top or bottom surface is smaller than a distance normal to the top or bottom surface between first and second anchor point, and
the height of the air gap is small enough that a damping of a movement of the sensor system towards the carrier is enabled, the height being greater than or equal to a minimum value by squeeze film damping due to air in the air gap,
wherein a damping structure is applied to at least one surface chosen from a first surface located on the carrier and a second surface located on the sensor system,
wherein first surface comprises the first anchor point and the second surface includes the second anchor point,
wherein the damping structure is applied as a layer between the sensor system and the carrier on the first surface or on the second surface, the height of the air gap being reduced by inserting the layer into the air gap,
wherein the layer forms a damping structure and is applied to the first or the second surface, and the layer includes recesses to accommodate the spring elements.
2. The MEMS device according to claim 1 ,
wherein the height of the air gap is small enough that a damping is enabled greater or equal to a minimum value by squeeze film damping due to air in the air gap.
3. The MEMS device according to claim 1 ,
wherein the damping structure comprises a metal, a polymer, a ceramic, an ink or any other layer that can be deposited in a controlled manner and that can be applied in an area according to a desired structure or that can be structured after deposition of the layer.
4. The MEMS device according to claim 1 , wherein the damping structure comprises an air channel to provide further damping by the damping structure.
5. The MEMS device according to claim 4 ,
wherein the air channel extends laterally and opens at an outer edge of the damping structure.
6. The MEMS device according to claim 4 ,
wherein the air channel broadens to accommodate a spring element.
7. The MEMS device according to claim 1 ,
wherein the spring elements and the damping structure comprise the same material.
8. A MEMS device, wherein
a sensor system is resiliently mounted on a carrier by means of spring elements,
the spring elements are metallic and comprise an elongated structure that is linear, bent or angled,
a first end of the extended structure is coupled to a first anchor point on the carrier,
a second end of the extended structure is coupled to a second anchor point on the sensor system,
an air gap is provided between a top surface of the carrier and a bottom surface of the sensor system,
a height of the air gap normal to the top or bottom surface is smaller than a distance normal to the top or bottom surface between first and second anchor point,
wherein a damping structure is applied to at least one surface chosen from a first surface located on the carrier and a second surface located on the sensor system,
wherein first surface comprises the first anchor point and the second surface comprises the second anchor point,
wherein the damping structure is applied as a layer between the sensor system and the carrier on the first surface or the second surface, the height of the air gap being reduced by inserting the layer into the air gap,
wherein the layer comprises recesses, and
wherein the recesses are at least measured to accommodate the spring elements.
9. The MEMS device according to claim 8 ,
wherein the height of the air gap is small enough that a damping is enabled greater or equal to a minimum value by squeeze film damping due to air in the air gap.
10. The MEMS device according to claim 8 ,
wherein the damping structure comprises a metal, a polymer, a ceramic, an ink or any other layer that can be deposited in a controlled manner and that can be applied in an area according to a desired structure or that can be structured after deposition of the layer.
11. The MEMS device according to claim 8 , wherein the spring elements and the damping structure comprise the same material.
12. A MEMS device, wherein
a sensor system is resiliently mounted on a carrier by means of spring elements,
the spring elements are metallic and comprise an elongated structure that is linear, bent or angled,
a first end of the extended structure is coupled to a first anchor point on the carrier,
a second end of the extended structure is coupled to a second anchor point on the sensor system,
an air gap is provided between a top surface of the carrier and a bottom surface of the sensor system,
a height of the air gap normal to the top or bottom surface is smaller than a distance normal to the top or bottom surface between first and second anchor point,
wherein a damping structure is applied to at least one surface chosen from a first surface located on the carrier and a second surface located on the sensor system,
wherein first surface comprises the first anchor point and the second surface comprises the second anchor point, and
wherein the damping structure comprises an air channel to provide further damping by the damping structure
wherein the damping structure comprises a metal, a polymer, a ceramic, an ink or any other layer that can be deposited in a controlled manner and that can be applied in an area according to a desired structure or that can be structured after deposition of the layer.
13. The MEMS device according to claim 12 , wherein the air channels broaden to accommodate a spring element each.
14. The MEMS device according to claim 12 , wherein the spring elements and the damping structure comprise the same material.
15. The MEMS device according to claim 12 ,
wherein the damping structure comprises a metal, a polymer, a ceramic, an ink or any other layer that can be deposited in a controlled manner and that can be applied in an area according to a desired structure or that can be structured after deposition of the layer.
16. The MEMS device according to claim 12 , wherein the air channel extends laterally and opens at an outer edge of the damping structure.