IP Library Granted Patent US 12,096,170
Granted Patent B2
US 12,096,170 · App. 18/328,311 · Granted Sep 17, 2024

Microphone component and method for fabricating microphone component

Inventors: Pirmin Hermann Otto Rombach (Kongens Lyngby, DK); Dennis Mortensen (Bagsvard, DK)
Assignee: TDK Corporation
H04R1/08H04R2201/003
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Quick Facts
Patent No.
US 12,096,170
App. No.
18/328,311
Granted
Sep 17, 2024
Kind
B2
Abstract

A microphone component and a method for fabricating a microphone component are disclosed. In an embodiment, a method includes fabricating a microphone component having a backplate and a membrane in a MEMS technology, forming a plurality of holes in the membrane, the holes having diameters smaller than 5 μm, choosing a value for a low frequency roll-off and a diameter of the holes in the membrane and choosing a number of holes such that the chosen value for low frequency roll-off is achieved.

Claims (29)

1. A method comprising:

fabricating a microphone component comprising a backplate and a membrane in a MEMS technology;

forming a plurality of holes in the membrane, the holes having diameters smaller than 5 μm;

choosing a first value for a low frequency roll-off and a second value for an allowed increase of a flow resistance with increasing pressure:

choosing a diameter of the holes in the membrane such that an increase of flow resistance with increasing pressure is below the second value; and

choosing a number of holes such that the first value for the low frequency roll-off is achieved.

2. The method of claim 1 , wherein the diameters are equal or smaller than 2 μm.

3. The method of claim 1 , wherein the number of the holes formed in the membrane is at least 100.

4. The method of claim 1 , wherein the membrane has a support region, in which the membrane is supported by a substrate, and a clearance region extending by at least 20 μm from the support region, and wherein the clearance region is free from any holes.

5. The method of claim 1 , wherein the backplate comprises further holes, wherein the holes in the membrane are positioned within the further holes of the backplate in a view on the backplate.

6. The method of claim 5 , wherein the further holes in the backplate are formed to have larger diameters than the holes in the membrane.

7. The method of claim 5 , wherein a number of the further holes in the backplate is larger than the number of the holes in the membrane.

8. The method of claim 1 , wherein the microphone component has a single-membrane design.

9. The method of claim 1 , wherein the holes are at least formed in a central region of the membrane.

10. The method of claim 9 , wherein the holes are formed to be equally distributed in the central region of the membrane.

11. The method of claim 1 , wherein the membrane has a central region having a first radius, and wherein a number of holes per surface area formed in the central region is less than a number of holes per surface area formed in a region adjoining the central region or wherein the central region is free from any holes.

12. The method of claim 1 , wherein the holes are positioned within a circular ring region of the membrane, the circular ring region being defined by a first radius and a second radius, and wherein a number of holes per surface area outside the circular ring region is less than a number of holes per surface area within the circular ring region or wherein regions outside the circular ring region are free from any holes.

13. The method of claim 1 , wherein the holes are formed to be equally distributed in a central region of the membrane.

14. A method comprising:

fabricating a microphone component comprising a backplate and a membrane in a MEMS technology;

forming a plurality of holes in the membrane, wherein the holes have diameters smaller than 5 μm, wherein the holes comprise first holes of a first diameter smaller than 5 μm and second holes of a second diameter smaller than 5 μm, but larger than the first holes, and wherein the first holes are configured for providing pressure equalization and the second holes are configured as release holes for etching;

choosing a value for a low frequency roll-off and a diameter of the first and second holes in the membrane; and

choosing a number of first holes such that the value for low frequency roll-off is achieved.

15. A method comprising:

fabricating a microphone component comprising a backplate and a membrane in a MEMS technology;

forming a plurality of holes in the membrane, the holes having diameters smaller than 5 μm;

choosing a value for a low frequency roll-off and a diameter of the holes in the membrane; and

choosing a number of holes such that a chosen value for the low frequency roll-off is achieved,

wherein the membrane has a central region having a first radius, and wherein a number of holes per surface area formed in the central region is less than a number of holes per surface area formed in a region adjoining the central region or wherein the central region is free from any holes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →