MEMS sensor package and its manufacturing method
Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.
1 . A MEMS sensor package comprising:
a substrate;
an annular-shaped first dry film pattern stuck to one surface of the substrate; and
a MEMS sensor chip including a support having a tubular shape and a detection part which is supported on the support so as to overlap a cavity of the support,
wherein the MEMS sensor chip is fixed to the substrate by an adhesion of an annular mounting surface of the support to the first dry film pattern.
2 . The MEMS sensor package as claimed in claim 1 ,
wherein the substrate has a through hole therein, and
wherein the first dry film pattern is provided so as to surround the through hole in a plan view.
3 . The MEMS sensor package as claimed in claim 1 , wherein an elastic modulus of the first dry film pattern is 1 MPa or more and 1 GPa or less.
4 . The MEMS sensor package as claimed in claim 1 , further comprising:
a second dry film pattern stuck to the one surface of the substrate; and
a controller IC mounted on the one surface of the substrate through the second dry film pattern.
5 . The MEMS sensor package as claimed in claim 4 , further comprising a bonding wire having a first end connected to the MEMS sensor chip and a second end connected to the controller IC.
6 . The MEMS sensor package as claimed in claim 5 , wherein the bonding wire is directly connected between the MEMS sensor chip and the controller IC without going through the substrate.
7 . The MEMS sensor package as claimed in claim 1 , wherein an elastic modulus of the first dry film pattern is 10 MPa or more and 1 GPa or less.
8 . The MEMS sensor package as claimed in claim 1 ,
wherein the substrate includes a plurality of insulating layers and a plurality of conductive layers stacked alternately, and
wherein an uppermost one of the plurality of insulating layers constitutes the one surface of the substrate such that the first dry film pattern is stuck to the uppermost one of the plurality of insulating layers without any of the plurality of conductive layers interposed therebetween.
9 . A method for manufacturing a MEMS sensor package, the method comprising:
sticking a photosensitive dry film resist on one surface of a substrate;
exposing and developing the photosensitive dry film resist to form an annular-shaped first dry film pattern;
preparing a MEMS sensor chip including a support having a tubular shape and a detection part which is supported on the support so as to overlap a cavity of the support and sticking an annular mounting surface of the support to the first dry film pattern, and then
curing the first dry film pattern.
10 . The method for manufacturing a MEMS sensor package as claimed in claim 9 , wherein, in the exposing and developing, the second dry film pattern is formed simultaneously with the first dry film pattern.
11 . The method for manufacturing a MEMS sensor package as claimed in claim 10 , further comprising sticking a controller IC to the second dry film after the exposing and developing and before the curing.
12 . The method for manufacturing a MEMS sensor package as claimed in claim 9 , wherein the curing is performed after the sticking.
13 . A MEMS sensor package comprising:
a substrate including a plurality of insulating layers and a plurality of conductive layers stacked alternately, the substrate having a through hole;
a dry film pattern stuck to an uppermost one of the plurality of insulating layers such that the dry film pattern surrounds the through hole of the substrate; and
a MEMS sensor chip including a support having a tubular shape and a detection part provided on a top surface of the support,
wherein the MEMS sensor chip is fixed to the substrate by sticking a bottom surface of the support to the dry film pattern such that a top surface of the dry film pattern is stuck to the bottom surface of the support and a bottom surface of the dry film pattern is stuck to the uppermost one of the plurality of insulating layers.
14 . The MEMS sensor package as claimed in claim 13 , wherein an elastic modulus of the dry film pattern is 10 MPa or more and 1 GPa or less.