Assignment of Assignor's Interest

Recorded: 2023-05-02 Pages: 3

Assignor

KOBAYASHI, TOYOTAKA

Executed: 2023-03-30

Assignee

CORPORATION, TDK

2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN

Covered Property (1)

Mems Sensor Package and Its Manufacturing Method

Application: 18/142,373 →

Publication: US 2023/0365396

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.