Lid, MEMS sensor component and methods of manufacturing
In an embodiment a lid includes a top section and a side section arranged below the top section. A vertical height of the top section is calculated by I TS *H B , I TS being a first multiple integer and H B being a basic height, and a vertical height of the side section is calculated by I ss * H B , I ss being a second multiple integer and HB being the basic height H B .
1. A lid comprising:
a top section; and
a side section below the top section,
wherein a vertical height of the top section is I TS *H B , I TS being a first multiple integer and H B being a basic height, and
wherein a vertical height of the side section is I ss *H B , I ss being a second multiple integer and H B being the basic height H B .
2. The lid according to claim 1 , wherein the lid is configured to accommodate mechanical and/or electrical parts of a component being selected from a micro electro mechanical system (MEMS) sensor or a MEMS microphone.
3. The lid according to claim 1 , wherein the top section and the side section comprise a material selected from a three-dimensional (3D) printable material, alloys, metals, nickel, titanium, brass, stainless steel, a copper alloy, or a copper alloy comprising 10% to 70% copper, 10% to 70% nickel and 10% to 70% zinc.
4. The lid according to claim 1 , wherein the side section comprises—on its surfaces—a groove structure based on a vertical periodicity H B .
5. The lid according to claim 1 , wherein the lid is free from corrugations caused by a raw sheet rolling or by a deep a drawing process.
6. The lid according to claim 1 , further comprising structures selected from stability structures selected from pillars, struts, strutted pillars and/or opening structures selected from holes and hole arrays.
7. The lid according to claim 1 , wherein a thickness—in a vertical direction—of the top section is different from a thickness—in a horizontal direction—of the side section by more than 25%.
8. The lid according to claim 1 , wherein the top section and the side section are monolithically connected to one another.
9. The lid according to claim 1 , wherein inner or outer edges of the lid have a radius smaller than 50 μm.
10. The lid according to claim 1 , wherein a content of metal atoms of solderable metals or alloys varies along a vertical direction.
11. The lid according to claim 1 , further comprising protrusions or notches at a bottom side of the side sections.
12. The lid according to claim 1 , wherein the lid is post-processed in an array by electro plating or electro-less plating.
13. The lid according to claim 1 , further comprising an inner lining made from a material with at least 5 times lower thermal conductivity compared to a lid material.
14. A micro electro mechanical system (MEMS) sensor component comprising:
the lid according to claim 1 .
15. The MEMS sensor component according to claim 14 , further comprising a carrier with a top side, wherein the lid is connected to the top side of the carrier.
16. The MEMS sensor component according to claim 15 , further comprising a MEMS chip accommodated in a volume at least partially enclosed by the carrier and the lid.
17. The MEMS sensor component according to claim 15 , wherein a bottom side of the side section of the lid is mechanically connected to metal structures on the top side of the carrier via soldering or gluing the lid to a surface of the carrier.
18. A method for manufacturing the lid according to claim 1 , the method comprising:
providing an additive manufacturing process.
19. The method according to claim 18 , wherein the additive manufacturing process comprises 3D printing involving melting or sintering meltable or sinterable powder to establish a layered structure with a layer thickness of H B .
20. The method according to claim 19 , further comprising utilizing an energy beam selected from a laser beam or an electron beam to melt or sinter the powder.