Patent Assignment
Reel/Frame 060412/0164
Assignment of Assignor's Interest
Recorded: 2022-07-06
Pages: 2
Assignor
TDK ELECTRONICS AG
Executed: 2022-01-26
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Lid, MEMS Sensor Component and Methods of Manufacturing
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.