MEMS device stress-reducing structure
A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.
1. A micro-electromechanical systems (MEMS) device comprising:
a substrate comprising an active region;
at least one integrated electrical and mechanical connection element on a mounting side of the MEMS device, the at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device with the mounting side to a carrier,
wherein the connection element comprises a stress-reducing structure,
wherein the connection element is at least partly formed by a part of the substrate,
wherein the connection element comprises at least one contact pad on the mounting side, and
wherein a trench on the mounting side in the substrate completely surrounds the contact pad; and
a conductor track partly arranged on a bridge element reaching over the trench.
2. The MEMS device according to claim 1 , wherein the connection element comprises at least two associated contact pads.
3. The MEMS device according to claim 2 , wherein each of the associated contact pads has an elongated cross-section.
4. The MEMS device according to claim 1 , wherein the connection element comprises a metal mixed with a filler.
5. The MEMS device according to claim 4 , wherein the metal is a solder metal.
6. The MEMS device according to claim 4 , wherein the filler comprises a gas.
7. The MEMS device according to claim 4 , wherein the filler comprises a plastic material.
8. The MEMS device according to claim 4 , wherein the filler comprises a plurality of filler elements, each of the filler elements having a filler element diameter which is equal to or less than 1/10 of a connection element diameter.
9. The MEMS device according to claim 4 , wherein the connection element has a solder-bump-like structure.
10. A micro-electromechanical systems (MEMS) device comprising:
a substrate comprising an active region;
at least two integrated electrical and mechanical connection elements on a mounting side of the MEMS device, the at least two integrated electrical and mechanical connection elements configured to electrically and mechanically mount the MEMS device with the mounting side to a carrier,
wherein each connection element comprises a stress-reducing structure,
wherein each connection element is at least partly formed by a part of the substrate,
wherein each connection element comprises at least one contact pad on the mounting side, and
wherein each contact pad is completely surrounded by a trench on the mounting side; and
a conductor track partly arranged on a bridge element reaching over the trench.
11. The MEMS device according to claim 10 , wherein each connection element comprises at least two associated contact pads.
12. The MEMS device according to claim 10 , wherein each connection element comprises a metal mixed with a filler.
13. The MEMS device according to claim 12 , wherein the metal is a solder metal.
14. The MEMS device according to claim 12 , wherein the filler comprises a gas.
15. The MEMS device according to claim 12 , wherein the filler comprises a plastic material.
16. The MEMS device according to claim 12 , wherein the filler comprises a plurality of filler elements, each of the filler elements having a filler element diameter which is equal to or less than 1/10 of a connection element diameter.