MEMS component, method for producing a MEMS component, and method for handling a MEMS component
View Patent ↗A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
1. A MEMS component comprising:
a substrate having an active side and an inactive side arranged opposite the active side;
at least one cavity disposed in the substrate such that the active side of the substrate closes off a bottom surface and side surfaces of the cavity;
a covering film overlying the inactive side of the substrate, wherein the covering film is not present in a region adjacent outer edges of the MEMS component such that no covering film touches the inactive side of the substrate in the region the adjacent outer edges of the MEMS component; and
an adhesive that adheres the covering film on the substrate.
2. The MEMS component as claimed in claim 1 , further comprising a membrane, wherein the at least one cavity is closed off on the active side of the substrate by the membrane.
3. The MEMS component as claimed in claim 1 , wherein the covering film comprises a polymer film.
4. The MEMS component as claimed in claim 3 , wherein the covering film comprises a polyimide film.
5. The MEMS component as claimed in claim 1 , wherein the covering film comprises a metal film.
6. The MEMS component as claimed in claim 1 , wherein the covering film is deformed concavely relative to a surface of the substrate in a region adjacent the at least one cavity.
7. The MEMS component as claimed in claim 1 , wherein the covering film is deformed convexly relative to a surface of the substrate in a region adjacent the at least one cavity.
8. The MEMS component as claimed in claim 1 , further comprising a metallization disposed on the covering film, the metallization extending as far as a region of the substrate uncovered by the covering film at the outer edges.
9. The MEMS component as claimed in claim 1 , further comprising further components arranged over the covering film.
10. The MEMS component as claimed in claim 1 , wherein the MEMS component comprises a pressure sensor.
11. The MEMS component as claimed in claim 1 , wherein the MEMS component comprises a microphone.
12. The MEMS component as claimed in claim 1 , wherein the MEMS component comprises a bridge-type FBAR.
13. The MEMS component as claimed in claim 1 , wherein the covering film has a thickness between 20 and 100 μm.
14. The MEMS component as claimed in claim 1 , wherein the adhesive covers the covering film over virtually the entire area of the covering film.
15. A method for producing a MEMS component, the method comprising:
producing cavities in a substrate wafer, wherein a bottom surface and side surfaces of each cavity is closed off by the substrate wafer toward an active side and each cavity has an opening toward an inactive side; and
applying a covering film to the inactive side of the substrate wafer, wherein the covering film is adhesively bonded to the substrate wafer at least in a region of the substrate wafer which does not form a cavity; and
severing the covering film along lines of a singulation pattern as far as the substrate wafer.
16. The method as claimed in claim 15 , wherein the covering film is applied over the entire area of the inactive side of the substrate wafer.
17. The method as claimed in claim 15 , wherein a membrane remains which closes off the active side of the cavity.
18. The method as claimed in claim 15 , wherein applying a covering film comprises applying a polymer film.
19. The method as claimed in claim 18 , further comprising adhesively bonding the active side of the substrate wafer onto a carrier film.
20. The method as claimed in claim 15 , wherein applying a covering film comprises applying a metal film.
21. The method as claimed in claim 15 , wherein severing the covering film comprises performing laser ablation.
22. The method as claimed in claim 15 , wherein severing the covering film comprises sawing.
23. The method as claimed in claim 15 , further comprising, after severing the covering film, applying a metal layer that covers the covering film and extends as far as the substrate wafer.
24. The method as claimed in claim 15 , wherein severing the covering film comprises performing a photolithographic step.
25. The method as claimed in claim 15 , further comprising singulating the substrate wafer into individual components using a sawing method.
26. The method as claimed in claim 15 , further comprising singulating the substrate wafer by laser cutting.
27. The method as claimed in claim 15 , further comprising singulating the substrate wafer by controlled breaking by incipient scribing.
28. The method as claimed in claim 15 , further comprising singulating the substrate wafer by means of energy input into a focal plane below a substrate surface.
29. The method component as claimed in claim 15 , wherein the adhesive covers the covering film over virtually the entire area of the covering film.
30. A method for handling a MEMS component that comprises a substrate having an active side and an inactive side opposite the active side, at least one cavity disposed in the substrate such that the active side of the substrate closes off a bottom surface and side surfaces of the cavity, a covering film overlying the inactive side of the substrate, and an adhesive that adheres the covering film on the substrate, wherein the covering film is removed in a region adjacent outer edges of the MEMS component, the method comprising:
gripping the MEMS component; and
positioning the MEMS component on a mounting substrate,
wherein the active side of the MEMS component is not in mechanical contact with the mounting substrate at least in the region of the cavity of the MEMS component.
31. The method as claimed in claim 30 , wherein gripping of the MEMS component and positioning on the mounting substrate are effected by means of suction.
32. The method as claimed in claim 31 , wherein the MEMS component is fixed between its active side and the mounting substrate via an opening in the mounting substrate by means of bumps.
33. The method as claimed in claim 32 , wherein the MEMS component is fixed between the mounting substrate and the inactive side of the MEMS component by means of adhesive bonding.
34. The method as claimed in claim 32 , further comprising applying an additional covering to the active side of the MEMS component prior to positioning and fixing.
35. The method as claimed in claim 30 , wherein the adhesive covers the covering film over virtually the entire area of the covering film.