IP Library Assignment 041264/0801
Patent Assignment
Reel/Frame 041264/0801

Assignment of Assignor's Interest

Recorded: 2017-02-15 Pages: 9
Assignor
EPCOS AG
Executed: 2016-11-01
Assignee
TDK CORPORATION
3-9-1 SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Properties (30)
Method for Manufacturing a Micro-Electromechanical Device and Micro-Electromechanical Device Obtained Therewith
Patent: 7,303,934 →
Application: 10/531,934 →
Publication: US 2006/0040505
Method of Manufacturing a Mems Device and Mems Device
Patent: 7,709,285 →
Application: 10/578,026 →
Publication: US 2007/0222007
Radio-Frequency Microelectromechanical Systems and Method of Manufacturing Such Systems
Patent: 8,367,215 →
Application: 10/578,027 →
Publication: US 2010/0255322
Spring Structure for Mems Device
Patent: 8,098,120 →
Application: 11/718,130 →
Publication: US 2008/0135385
Electronic Device
Patent: 8,203,402 →
Application: 11/718,137 →
Publication: US 2009/0211885
Electrical Module with a Mems Microphone
Patent: 8,184,845 →
Application: 11/816,964 →
Publication: US 2008/0247585
Mems Microphone
Patent: 8,582,788 →
Application: 11/816,969 →
Publication: US 2008/0267431
Mems Tunable Device
Patent: 8,027,143 →
Application: 12/090,004 →
Publication: US 2008/0253057
Mems Microphone, Production Method and Method for Installing
Patent: 8,229,139 →
Application: 12/092,423 →
Publication: US 2008/0279407
Mems Package and Method for the Production Thereof
Patent: 8,169,041 →
Application: 12/092,439 →
Publication: US 2009/0001553
Component Comprising a Mems Microphone and Method for the Production of Said Component
Patent: 8,218,794 →
Application: 12/409,328 →
Publication: US 2009/0232336
Arrangement Comprising a Microphone
Patent: 8,553,920 →
Application: 12/605,920 →
Publication: US 2010/0272302
MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component
Patent: 8,674,464 →
Application: 12/842,677 →
Publication: US 2011/0018076
Semiconductor Chip Arrangement with Sensor Chip and Manufacturing Method
Patent: 8,580,613 →
Application: 12/999,421 →
Publication: US 2011/0233690
Method for Encapsulating an Mems Component
Patent: 9,051,174 →
Application: 13/003,148 →
Publication: US 2011/0180885
Mems-Microphone
Patent: 8,611,566 →
Application: 13/037,503 →
Publication: US 2012/0224726
Flat Back Plate
Patent: 9,181,087 →
Application: 13/038,459 →
Publication: US 2012/0225259
Component Comprising a Chip in a Cavity and a Stress-Reduced Attachment
Patent: 8,531,018 →
Application: 13/050,260 →
Publication: US 2011/0230068
Mems Package and Method for the Production Thereof
Patent: 8,432,007 →
Application: 13/075,936 →
Publication: US 2011/0186943
Sensor Module and Method for Producing Sensor Modules
Patent: 9,061,888 →
Application: 13/190,732 →
Publication: US 2011/0298064
Mems Microphone
Patent: 8,571,239 →
Application: 13/282,668 →
Publication: US 2012/0093346
Microphone Arrangement
Patent: 9,143,851 →
Application: 13/289,862 →
Publication: US 2012/0114145
Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method
Patent: 9,056,760 →
Application: 13/520,923 →
Publication: US 2013/0119492
Mems Microphone and Method for Manufacture
Patent: 8,664,733 →
Application: 13/579,433 →
Publication: US 2012/0326249
Electric Component Having a Shallow Physical Shape, and Method of Manufacture
Patent: 9,084,366 →
Application: 13/698,350 →
Publication: US 2013/0121523
Mems Microphone and Method for Producing the Mems Microphone
Patent: 8,865,499 →
Application: 13/805,630 →
Publication: US 2013/0140656
Microphone Arrangement
Patent: 9,357,294 →
Application: 13/980,700 →
Publication: US 2014/0003609
Mems Device Comprising an Under Bump Metallization
Patent: 9,369,066 →
Application: 13/983,947 →
Publication: US 2014/0035434
Microphone and Method to Position a Membrane Between Two Backplates
Patent: 9,197,967 →
Application: 14/002,500 →
Publication: US 2014/0037121
Mems Microphone and Method for Manufacture
Patent: 9,133,016 →
Application: 14/171,989 →
Publication: US 2014/0145276
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 19, 2005
From: VAN BEEK, JOSEF THOMAS MARTINUS; VAN GROOTEL, MARGOT
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 017174/0489 →
Assignment of Assignor's Interest Mar 13, 2007
From: VAN BEEK, JOSEF T.M.; ULENAERS, MATHIEU J.E.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 019006/0629 →
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest Nov 12, 2007
From: STEENEKEN, PETER G.; VAN BEEK, JOZEF THOMAS MARTINUS; RIJKS, THEO
To: NXP B.V.
Reel/Frame 020097/0507 →
Assignment of Assignor's Interest Jan 9, 2008
From: LEIDL, ANTON; PAHL, WOLFGANG; WOLFF, ULRICH
To: EPCOS AG
Reel/Frame 020338/0820 →
Assignment of Assignor's Interest Mar 31, 2008
From: DEN TOONDER, JACOB M., J.; VAN DIJKEN, AUKE R.; RIJKS, THEODOOR G., S., M.; VAN BEEK, JOZEF T., M.
To: NXP B.V.
Reel/Frame 020729/0650 →
Assignment of Assignor's Interest Apr 11, 2008
From: RIJKS, THEODOOR GERTRUDIS SILVESTER MARIA; STEENEKEN, PETER GERARD
To: NXP B.V.
Reel/Frame 020790/0565 →
Assignment of Assignor's Interest May 5, 2008
From: PAHL, WOLFGANG
To: EPCOS AG
Reel/Frame 020898/0489 →
Assignment of Assignor's Interest Jun 18, 2008
From: PAHL, WOLFGANG; LEIDL, ANTON; SEITZ, STEFAN; KRUEGER, HANS
To: EPCOS AG
Reel/Frame 021115/0962 →
Assignment of Assignor's Interest Jun 24, 2008
From: LEIDL, ANTON; PAHL, WOLFGANG; WOLFF, ULRICH
To: EPCOS AG
Reel/Frame 021145/0480 →
Assignment of Assignor's Interest Dec 10, 2008
From: STEENEKEN, PETER G.; VAN BEEK, JOZEF THOMAS MARTINUS; RIJKS, THEODOOR G.S.M.
To: EPCOS AG
Reel/Frame 021951/0982 →
Assignment of Assignor's Interest May 28, 2009
From: PAHL, WOLFGANG
To: EPCOS AG
Reel/Frame 022744/0265 →
Assignment of Assignor's Interest Dec 9, 2009
From: FEIERTAG, GREGOR; LEIDL, ANTON
To: EPCOS AG
Reel/Frame 023630/0833 →
Assignment of Assignor's Interest Jan 28, 2010
From: NXP B.V.
To: EPCOS AG
Reel/Frame 023862/0284 →
Assignment of Assignor's Interest Oct 5, 2010
From: PAHL, WOLFGANG; FEIERTAG, GREGOR; LEIDL, ANTON
To: EPCOS AG
Reel/Frame 025094/0669 →
Assignment of Assignor's Interest Mar 21, 2011
From: FEIERTAG, GREGOR; KRUEGER, HANS; LEIDL, ANTON; STELZL, ALOIS
To: EPCOS AG
Reel/Frame 025991/0059 →
Assignment of Assignor's Interest Apr 8, 2011
From: PAHL, WOLFGANG; LEIDL, ANTON; JUNGKUNZ, MATTHIAS; BEER, ANDREAS
To: EPCOS AG
Reel/Frame 026097/0772 →
Assignment of Assignor's Interest Apr 8, 2011
From: PAHL, WOLFGANG; FEIERTAG, GREGOR
To: EPCOS AG
Reel/Frame 026095/0661 →
Assignment of Assignor's Interest Apr 8, 2011
From: MORTENSEN, DENNIS; ROMBACH, PIRMIN HERMANN OTTO
To: EPCOS AG
Reel/Frame 026095/0617 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →