IP Library Granted Patent US 8,027,143
Granted Patent B2
US 8,027,143 · App. 12/090,004 · Granted Sep 27, 2011

MEMS tunable device

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Quick Facts
Patent No.
US 8,027,143
App. No.
12/090,004
Granted
Sep 27, 2011
Kind
B2
Abstract

A micro-electromechanical device has a substrate ( 60 ), a movable element ( 15 ), a pair of electrodes ( 40 ) arranged on the substrate and on the movable element to move the movable element, and a controller ( 50 ) to supply the electrodes. To move the movable element to an intermediate position one or more pulses are applied during the movement, timed to compensate for under or over damping of the movement. This can reduce a settling delay. It can be applied to tunable RF capacitors. To control a decrease in the gap, a single pulse of a maximum supply level compensates for the inherent slowness of the device and over damping. To compensate for under damping, the pulses have a period corresponding to a resonant frequency, and comprise peaks and troughs above and below the final supply level, such that successive ones of the peaks and troughs are closer to the given supply level.

Claims (27)

1. A micro-electromechanical device comprising:

a substrate,

a movable element,

a pair of electrodes arranged on the substrate and on the movable element to cooperate to move the movable element relative to the substrate, and

a controller arranged to supply electrical power to the electrodes to move the movable element to an intermediate position between a maximum and a minimum position, the controller providing a pulse or pulses having a first level higher than a second level required to hold the movable element at the intermediate position and then reducing to the second level to stabilize the movable element at the intermediate position, wherein the controller is arranged to control a voltage differential between the electrodes to vary an electrostatic force,

wherein the controller supplies a single pulse of a maximum supply level to control an increase in a gap between the electrodes, and

wherein the controller supplies a sequence of pulses timed to dampen oscillations of the movable element to control a decrease in the gap between the electrodes.

2. The device of claim 1 , wherein the single pulse has a duration that is dependent on the supply levels before and after movement.

3. The device of claim 1 , wherein the sequence is dependent on the supply levels before and after movement.

4. The device of claim 1 , wherein the sequence has a period corresponding to a resonant frequency, and comprises a number of peaks and troughs above and below the given supply level, such that successive ones of the peaks and troughs are closer to the given supply level.

5. The device of claim 1 , further comprising capacitor electrodes on the substrate and on the movable element, to form a tunable capacitor.

6. The device of claim 1 , further comprising a resilient coupling to bias the movable element.

7. The device of claim 6 , wherein the resilient coupling is arranged on at least two sides of the movable element.

8. A method of controlling a movable element of a micro-electromechanical device having a substrate, a movable element, a pair of electrodes arranged on the substrate and on the movable element to cooperate to move the movable element relative to the substrate, the method comprising:

moving the movable element to a first intermediate position by supplying a single pulse of a maximum supply level to the electrodes, the maximum supply level at a level which is higher than a second level required to hold the movable element at the first intermediate position, wherein moving to the first intermediate position comprises increasing a gap between electrodes; and

supplying the second level to stabilize the movable element at the first intermediate position after moving the movable element to the first intermediate position.

9. The method of claim 8 , further comprising:

moving the movable element to a second intermediate position by supplying a sequence of pulses timed to dampen oscillations of the movable element to the electrodes during the movement, the pulses being at a level which is higher than a third level required to hold the movable element at the second intermediate position, wherein moving to the second intermediate position comprises decreasing the gap between electrodes; and

supplying the third level to stabilize the movable element at the second intermediate position after moving the movable element to the second intermediate position.

10. The method of claim 8 , wherein the single pulse has a duration that is dependent on supply levels before and after the movement.

11. A method of controlling a movable element of a micro-electromechanical device having a substrate, a movable element, a pair of electrodes arranged on the substrate and on the movable element to cooperate to move the movable element relative to the substrate, the method comprising:

moving the movable element to an intermediate position by supplying a sequence of pulses timed to dampen oscillations of the movable element to the electrodes during the movement, the pulses being at a level which is higher than a second level required to hold the movable element at the intermediate position, wherein moving to the intermediate position comprises decreasing a gap between electrodes; and

supplying the second level to stabilize the movable element at the intermediate position after moving the movable element to the intermediate position.

12. The method of claim 11 , wherein the sequence is dependent on supply levels before and after the movement.

13. The method of claim 11 , wherein the sequence has a period corresponding to a resonant frequency.

14. The method of claim 13 , wherein the sequence comprises a number of peaks and troughs above and below the given supply level, wherein successive ones of the peaks and troughs are closer to the given supply level.

15. The method of claim 11 , wherein the sequence comprises a number of peaks and troughs above and below the given supply level, wherein successive ones of the peaks and troughs are closer to the given supply level.

Assignments (14)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2017
From: EPCOS AG
To: TDK CORPORATION
Reel/Frame 041264/0801 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2010
From: NXP B.V.
To: EPCOS AG
Reel/Frame 023862/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2008
From: RIJKS, THEODOOR GERTRUDIS SILVESTER MARIA; STEENEKEN, PETER GERARD
To: NXP B.V.
Reel/Frame 020790/0565 →