Patent Assignment
Reel/Frame 049712/0544
Assignment of Assignor's Interest
Recorded: 2019-07-10
Pages: 6
Assignors
KIM, JUN-HYUNG
Executed: 2019-01-29
KIM, SUNG-HYUP
Executed: 2019-01-28
KIM, TAE-YEONG
Executed: 2019-02-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Bonding Substrates Having a Substrate Holder with Holding Fingers and Method of Bonding Substrates