Patent Assignment
Reel/Frame 049714/0037
Assignment of Assignor's Interest
Recorded: 2019-07-10
Pages: 7
Assignors
KANG, CHI-GOO
Executed: 2019-06-10
KIM, YOUNG-KYUNG
Executed: 2019-06-10
PARK, YOUNG-HO
Executed: 2019-06-10
PARK, JONG-WON
Executed: 2019-06-10
LIM, SEOG-HO
Executed: 2019-06-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Device Package and Method of Manufacturing Light Emitting Device Package