Patent Assignment
Reel/Frame 049716/0325
Assignment of Assignor's Interest
Recorded: 2019-07-10
Pages: 6
Assignors
LEE, DONGJUN
Executed: 2019-06-04
SHIN, SANG CHUL
Executed: 2019-06-04
KIM, BONG-SOO
Executed: 2019-06-04
KIM, JIYOUNG
Executed: 2019-06-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device and Method of Fabricating the Same