Patent Assignment
Reel/Frame 049717/0743
Assignment of Assignor's Interest
Recorded: 2019-07-10
Pages: 5
Assignors
NAGAHISA, YUICHI
Executed: 2019-06-11
HINO, SHIRO
Executed: 2019-05-29
SADAMATSU, KOJI
Executed: 2019-05-27
HATTA, HIDEYUKI
Executed: 2019-05-29
KAWAHARA, KOTARO
Executed: 2019-05-28
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Silicon Carbide Semiconductor Device having a Conductive Layer formed above a Bottom Surface of a Well Region so as not to be in Ohmic Connection with the Well Region and Power Converter including the same