Patent Assignment
Reel/Frame 049724/0143
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 7
Assignors
LEE, HYUEK JAE
Executed: 2019-06-13
KIM, TAE HUN
Executed: 2019-06-12
HWANG, JI HWAN
Executed: 2019-06-13
KIM, JI HOON
Executed: 2019-06-12
HONG, JI SEOK
Executed: 2019-06-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Test Pad