Patent Assignment
Reel/Frame 049724/0347
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 4
Assignors
OTSUKA, YOSHITAKA
Executed: 2019-06-24
KODAMA, MUNEHISA
Executed: 2019-06-24
YAMASAKI, YUTAKA
Executed: 2019-06-24
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method