Patent Assignment
Reel/Frame 049724/0711
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 4
Assignors
CHEAH, BOK ENG
Executed: 2019-07-02
KONG, JACKSON CHUNG PENG
Executed: 2019-07-02
KUAN, CHIN LEE
Executed: 2019-07-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stacked-Component Placement in Multiple-Damascene Printed Wiring Boards for Semiconductor Package Substrates