Patent Assignment
Reel/Frame 049731/0763
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 3
Assignors
PENG, SHIH-WEI
Executed: 2019-07-02
LIN, WEI-CHENG
Executed: 2019-07-02
TZENG, JIANN-TYNG
Executed: 2019-07-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Semiconductor Device