Patent Assignment
Reel/Frame 049732/0066
Assignment of Assignor's Interest
Recorded: 2019-07-12
Pages: 5
Assignors
TSENG, YING-CHENG
Executed: 2019-06-04
TSAI, HAO-YI
Executed: 2019-06-04
KUO, TIN-HAO
Executed: 2019-06-04
LIU, CHIA-HUNG
Executed: 2019-06-21
LAI, CHI-HUI
Executed: 2019-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof