Patent Assignment
Reel/Frame 049732/0090
Assignment of Assignor's Interest
Recorded: 2019-07-12
Pages: 4
Assignors
CHEN, CHIEN-HSUN
Executed: 2019-06-21
WU, JIUN-YI
Executed: 2019-06-21
WANG, SHOU-YI
Executed: 2019-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure, Rdl Structure Comprising Redistribution Layer Having Ground Plates and Signal Lines and Method of Forming the Same