Patent Assignment
Reel/Frame 049745/0865
Assignment of Assignor's Interest
Recorded: 2019-07-12
Pages: 5
Assignors
LIAO, WEI-HAO
Executed: 2019-05-31
TIEN, HSI-WEN
Executed: 2019-06-04
LU, CHIH-WEI
Executed: 2019-05-31
DAI, PIN-REN
Executed: 2019-05-31
LEE, CHUNG-JU
Executed: 2019-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Method for an MRAM Device with a Multi-Layer Top Electrode