Patent Assignment
Reel/Frame 049753/0309
Assignment of Assignor's Interest
Recorded: 2019-07-15
Pages: 8
Assignors
SUNG, MINKYU
Executed: 2019-04-01
LEE, SUNG-KI
Executed: 2019-04-01
SUNG, DOUGYONG
Executed: 2019-04-22
LEE, SANG-HO
Executed: 2019-04-11
JEON, KANGMIN
Executed: 2019-04-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Gas Injection Module, Substrate Processing Apparatus, and Method of Fabricating Semiconductor Device Using the Same