Patent Assignment
Reel/Frame 049753/0847
Assignment of Assignor's Interest
Recorded: 2019-07-15
Pages: 3
Assignors
HUANG, KUAN-YU
Executed: 2019-04-19
HUANG, SUNG-HUI
Executed: 2019-04-19
LAI, JUI-HSIEH
Executed: 2019-04-19
HOU, SHANG-YUN
Executed: 2019-04-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Package Structure with Underfill