Patent Assignment
Reel/Frame 049755/0578
Assignment of Assignor's Interest
Recorded: 2019-07-15
Pages: 10
Assignors
YOO, SE-JIN
Executed: 2019-06-13
JOO, HONG-SUB
Executed: 2019-06-17
HAN, WON-GIL
Executed: 2019-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Semiconductor Package