Patent Assignment
Reel/Frame 049763/0109
Assignment of Assignor's Interest
Recorded: 2019-07-16
Pages: 4
Assignors
EGUSA, MINORU
Executed: 2019-05-08
SUDO, SHINGO
Executed: 2019-05-16
HASHIMOTO, KAZUYUKI
Executed: 2019-05-09
SUZUKI, ERUBI
Executed: 2019-05-13
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Ultrasonic Bonding Apparatus, Ultrasonic Bonding Inspection Method and Ultrasonically-Bonded Portion Fabrication Method