Patent Assignment
Reel/Frame 049783/0739
Assignment of Assignor's Interest
Recorded: 2019-07-17
Pages: 4
Assignor
KUO, TE-HSIEN
Executed: 2019-07-10
Assignee
NOVATEK MICROELECTRONICS CORP.
2F, NO. 13, INNOVATION ROAD I, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Chip on Film Package Structure and Method for Reading a Code-Included Pattern on a Package Structure