Patent Assignment
Reel/Frame 049783/0867
Assignment of Assignor's Interest
Recorded: 2019-07-17
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-07-10
YEH, SUNG-FENG
Executed: 2019-07-10
LIU, TZUAN-HORNG
Executed: 2019-07-10
SHIH, CHAO-WEN
Executed: 2019-07-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure, Chip Structure and Method of Fabricating the Same