Patent Assignment
Reel/Frame 049807/0525
Assignment of Assignor's Interest
Recorded: 2019-07-19
Pages: 6
Assignors
CHEON, JI-SUNG
Executed: 2019-05-09
BAEK, SEOK-CHEON
Executed: 2019-05-09
SON, YOON-HWAN
Executed: 2019-05-09
CHOI, JUN-YOUNG
Executed: 2019-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3-Dimensional Semiconductor Memory Device