Patent Assignment
Reel/Frame 049854/0161
Assignment of Assignor's Interest
Recorded: 2019-07-25
Pages: 4
Assignors
HSU, CHIA-HAO
Executed: 2019-06-18
LIN, YUNG-CHI
Executed: 2019-06-18
CHIOU, WEN-CHIH
Executed: 2019-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same