Patent Assignment
Reel/Frame 049874/0817
Assignment of Assignor's Interest
Recorded: 2019-07-26
Pages: 7
Assignors
HUH, JUNGHWAN
Executed: 2019-04-09
KIM, DONGCHAN
Executed: 2019-04-09
KIM, DAE HYUN
Executed: 2019-04-09
KIM, EUIJU
Executed: 2019-04-09
LEE, JISOO
Executed: 2019-04-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same