Patent Assignment
Reel/Frame 049878/0335
Assignment of Assignor's Interest
Recorded: 2019-07-26
Pages: 11
Assignors
YEN, YOU-LUNG
Executed: 2019-07-24
APPELT, BERND KARL
Executed: 2019-07-24
ESSIG, KAY STEFAN
Executed: 2019-07-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same