Patent Assignment
Reel/Frame 049885/0658
Assignment of Assignor's Interest
Recorded: 2019-07-29
Pages: 4
Assignors
WU, CHIH-WEI
Executed: 2019-07-22
KUO, LI-CHUNG
Executed: 2019-07-19
WANG, PU
Executed: 2019-07-19
SHIH, YING-CHING
Executed: 2019-07-19
LU, SZU-WEI
Executed: 2019-07-19
YEH, KUNG-CHEN
Executed: 2019-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dummy Die Placement Without Backside Chipping