IP Library › Assignment 049902/0294
Patent Assignment
Reel/Frame 049902/0294

Assignment of Assignor's Interest

Recorded: 2019-07-30 Pages: 9
Assignors
CHOI, JAE SIK
Executed: 2019-07-22
JEONG, JIN WON
Executed: 2019-07-23
SONG, BYEUNG SOO
Executed: 2019-07-24
SHIM, DONG KI
Executed: 2019-07-23
BAE, JIN HAN
Executed: 2019-07-23
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Method of Forming and Packaging Semiconductor Die
Application: 16/526,020 →
Publication: US 2020/0312715
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →