Patent Assignment
Reel/Frame 049903/0686
Assignment of Assignor's Interest
Recorded: 2019-07-30
Pages: 12
Assignors
HIDAKA, SHOICHIRO
Executed: 2019-07-23
IKEDA, BOUI
Executed: 2019-07-22
SEKIMOTO, EIICHI
Executed: 2019-07-26
IWANAGA, KAZUYA
Executed: 2019-07-23
HAYASHI, MASATO
Executed: 2019-07-27
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method