Patent Assignment
Reel/Frame 049909/0624
Assignment of Assignor's Interest
Recorded: 2019-07-30
Pages: 4
Assignors
WANG, PO-HAN
Executed: 2019-07-16
KUO, HUNG-JUI
Executed: 2019-07-16
HU, YU-HSIANG
Executed: 2019-07-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof